products

Resin SZUV-T1120-high temperature resistance

Kout Deskripsyon:

SZUV-T1120 is a high temperature resistance resin for SLA 3D printers.

 3D materyèl ekri

pwodwi Detay

Physical Properties

Product Tags

3D Enpresyon Materyèl

High temperature resistance- SZUV-T1120

Jeneral Entwodiksyon

Karakteristik:

SZUV -T1120 se yon résine SL jòn ki te gen depaman pèfòmans tèmik. Li ka kenbe tèt ak tanperati nan excès de 200 ℃ a yon ti tan ak 120 ℃ nan yon tan long. Li fèt pou manyen yon gran varyete tanperati ki wo yo ak aplikasyon pou tès negatif.

耐高温 2
耐高温 1

karakteristik tipik

HIGH fòs ak bon rezistans

SZUV-T1120 can stand up humidity, water and solvents, such as gasoline, transmission fluid, oil and coolant. With its unmatched heat resistance, it is suitable for flow, HVAC, lighting, tooling, molding and wind tunnel testing applications. 

-BUILD pi vit ak devlope pi vit

By providing fast output and parts with a smooth, easy-to-handling surface, SZUV-T1120 can finishing your project from drawing to testing parts in the shortest time. 

Application Cases

-Under-tès la kapo eleman

tanperati -Segondè RTV bòdi

-Wind tès tinèl 

-Lighting tès aparèy

-Composite otoklav outillage 

-HVAC tès eleman 

-Intake manifoul tès 

-Orthodontics

耐高温 3

APPLICATION FIELDS

btn12
btn7
汽车 配件
包装 设计
艺术 设计
医疗 领域

Edikasyon

men Moules

Auto Pati

Emballage Design

Atizay Design

Medikal


  • Previous:
  • Next:

  • PHYSICAL PROPERTIES (LIQUID)

    aparans white
    dansite 

    1.13g / cm 3 @ 25 ℃

    viskozite

    400~480 cps @ 29 ℃

    Dp

    0.152mm

    Ce

    7.6 mJ/cm2

    Building epesè kouch 

    0.05 ~ 0.12mm

     

    MECHANICAL PROPERTIES (POST-CURED)

    Measurement

    Test Method

    Value

    90-minit UV pòs-geri

    90-minute UV +2 hours@160℃ thermal post-cure

    Dite, Shore D ASTM D 2240 87 91
    En Modil, MPA ASTM D 790 2678-3186 3502-3631
    En fòs, MPA ASTM D 790 60-80 90-101
    Rupture Modil, MPA ASTM D 638 2840-3113 3484-3771
    Rupture fòs, MPA ASTM D 638 58-67 50-62
    Pwolonjman nan repo ASTM D 638 4-8% 4-6%
    fòs enpak, crainte lzod, J / m ASTM D 256 18-30 16-23
    Heat deflection temperature, ℃ ASTM D 648 @ 66PSI 81 98
    Glass transition, Tg, ℃ DMA,E’peak 100 111
    Coefficient of thermal expansion, E6/℃ TMA(T<Tg) 79 86
    Thermal conductivity, W/m.℃ 0,171
    dansite 1.24
    absòpsyon dlo ASTM D 570-98 0.49% 0.46%

     

    Pwopriyete mekanik nan Post-geri Materyèl

    MEZI

    METÒD POU FÈ tÈS

     

     

    VALÈ

     

     

    90-minit UV pòs-geri

    90-minit UV +2 èdtan @ 160  tèmik  pòs-geri

    Dite, Shore D

    ASTM D 2240

    87

    91

    En Modil, MPA

    ASTM D 790

    2678-3186

    3502-3631

    En fòs, MPA

    ASTM D 790

    60-80

    90-101

    Rupture Modil, MPA

    ASTM D 638

    2840-3113

    3484-3771

    Rupture fòs, MPA

    ASTM D 638

    58-67

    50-62

    Pwolonjman nan repo

    ASTM D 638

    4-8%

    4 -6%

    fòs enpak, crainte lzod, J / m

     

    ASTM D 256

     

    18 ~ 30

     

    16 ~ 23

    Chalè déplacement tanperati a, 

     

    ASTM D 648 @ 66PSI

     

    81

    98

     

    Glass tranzisyon, Tg

    ,

    DMA , E " pik

     

    100

    111

     

    Koyefisyan nan ekspansyon tèmik, E6 /

    TMA ( T <Tg )

     

    79

     

    86

     

    Tèmik konduktiviti, W / m.

     

    0,171

     

    dansite

     

    1.24

     

    absòpsyon dlo

    ASTM D 570-98

    0.49%

    0.46%

  • Ekri mesaj ou a isit la epi voye li nan nou